Description
Key Features
Adopts high-quality 3D NAND wafer level chip
Supports PCIe3.0 x4, and NVMe 1.3 protocol
All-metal cooling plate is included; equipped with intelligent temperature control technology
Supports TRIM to improve read/write performance and speed
Supports Max. Write technology for full-disk SLC cache
Supports LDPC ECC
Low power consumption management
Specs
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Technical Specication |
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Product Model |
DHI-SSD-E900N256G |
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Capacity1 |
256 GB |
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Form Factor |
M.2 2280 |
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Port |
PCIe Gen 3.0 x 4 |
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Net Weight |
Max 8 g (0.02 lb) |
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Product Dimensions2 |
80.0 mm x 23.0 mm x 4.8 mm (3.15″ x 0.91″ x 0.19″) |
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Packaging Dimensions |
140.5 mm x 105.5 mm x 15.5 mm (5.53″ x 4.15″ x 0.61″) |
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Memory Component |
3D TLC |
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Power Consumption2 |
2597 mW (max) |
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S.M.A.R.T |
Support |
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TRIM |
Support |
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Garbage Collection |
Support |
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Sequential Read2 |
Up to 2000 MB/s |
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Sequential Write2 |
Up to 1050 MB/s |
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4K Random Read2 |
Up to 90000 |
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4K Random Write2 |
Up to 190000 |
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MTBF |
1,500,000 hours |
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Operating Temperature |
0C to 70C (32F to 158F) |
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Storage Temperature |
40C to 85C (40F to 185F) |
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Operating Humidity |
95% (non-condensing) |
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Vibration Resistance |
800 Hz, 3.08 G |
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Shock Resistance |
1500 G/0.5 ms (half sine wave) |
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TBW |
128 TB |
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